MF152900 - SEMI MF1529 - Test Method for Sheet Resistance Uniformity Evaluation by In-Line Four-Point Probe with the Dual-Configuration Procedure Revision:SEMI MF1529-1104 - Superseded residue after evaporation (RAE) (nonvolatile

residue after evaporation (RAE) (nonvolatile residue [NVR])

SEMI MF1811-0309 (technical revision)

1  This Standard is applicable for plastic substrates of flexible display manufacturing

SEMI E40 — Standard for Processing Management

The potential and actual effects of bond voids on the performance and reliability of fabricated devices are beyond the scope of this Guide

MF152900 - SEMI MF1529 - Test Method for Sheet Resistance Uniformity Evaluation by In-Line Four-Point Probe with the Dual-Configuration Procedure Revision:SEMI MF1529-1104 - Superseded residue after evaporation (RAE) (nonvolatileThe sheet resistance of epitaxial, implanted, diffused or deposited films is an important materials acceptance and process control parameter. The uniformity across a wafer of the sheet resistance resulting from any of these processes is important for the equivalence of performance of devices or circuits made from various regions of the wafer. This Test Method uses a four point probe in a manner different from that of other ASTM methods for the